Semiconductors
FASA serves global semiconductor manufacturer by providing them major semiconductor processing equipment. We have successfully built and developed over a hundred customized systems capable of processing and testing semiconductor Packages, IC chips, Wafers, Substrates, Lead Frames and others.
FASA’s extensive experience in providing manufacturing solution to semiconductor industry have developed a wide range of technology to cater to your unique manufacturing requirements. We offer flexible manufacturing system that is designed to be adaptable to the changes in the product which provides manufacturers an advantage in a rapidly changing manufacturing environment. It Includes Flexible Testing and Burn-in systems to determine your components reliability and eliminate defective components before they are integrated into larger systems.
GT-100 HV/PD & DC Test Handler
Automatic transfer of IC Packages or Devices contained in plastic tubes to test station where customer-defined tests such as High Voltage (HV), Partial Discharge (PD) & DC are performed on each device.
Product: Able to handle wide range IC packages
Handling: Gravity Feed Tube to Tube Transfer, Shuttle, Tube Sorter
Function: Sorting, Testing
Test Modes: Burn in High Voltage (HV), Partial Discharge (PD) & DC
GT-101 Tube-To-Tube Gravity-Feed Test Handler
Automatic transfer of IC Packages or Devices contained in plastic tubes to High Voltage Test Station for the testing and sorting of devices into defective and non-defective categories. The test station can test 1 unit or 4 units at a time.
Product: Able to handle wide range IC packages
Handling: Gravity Feed Tube to Tube Transfer, Shuttle, Tube Sorter
Function: Sorting, Testing
Test Modes: Burn in Multiple Unit High Voltage Test
GT-201 TUBE-TO-TUBE GRAVITY-FEED TEST HANDLER
Automatic transfer of IC Packages or Devices contained in plastic tubes to more than one test stations for the testing and sorting of devices into defective and non-defective categories.
Product: 5 Lead SOIC (Min), 5mm ~12 mm
Handling: Gravity Feed Tube to Tube Transfer, Shuttle, Tube Sorter
Function: Testing, Sorting
Test Modes: Burn in Single/ in-line DC/ HV/ PD Test (Customizable)
GT-401 TUBE TO TUBE GRAVITY-FEED 4 IN 1 TEST HANDLER
Automatic transfer of IC Packages or Devices contained in plastic tubes to Function Test, Laser Marking, and Vision Check stations for testing and for sorting of the devices according to the test results. Finishes products are unloaded to different tubes, or packaged on Tape and Reel station based on User’s selection.
Product: Able to handle wide range IC packages
Handling: Gravity Feed Tube to Tube Transfer, Tube Sorter, Shuttle, Tape and Reel
Function: Burn-in Testing Package Test, Laser Marking, Vision Inspection
Test: Function Test, Laser Marking, and Vision Check stations (Customizable)
Hot Temp Package DC Test Handler
Automatic transfer of IC Packages or Devices contained in plastic tubes to Track & Singulator unit for Hot Temperature DC testing and Sorting.
Product: Able to handle wide range IC packages
Handling: Gravity Feed Tube to Tube Transfer, Track & Singulator, Tube Sorter, Shuttle, Tape and Reel.
Function: Testing, Heating, Cooling
Test: Hot Temp Burn-in DC Test (Customizable)
Multi-Site Test Handler
Performs high speed high reliability testing and packaging of semi-conductor packages. Finished products are packaged into tape on the Tape & Reel module, while the reject packages are unloaded to up to 20 different reject sorting bins.
Product: Able to handle wide range IC packages.
Handling: Vibratory bowl feeder & linear track, Automatic Indexing table, Four auto-pick and place modules.
Function: Test, Tape and Reel (Package), Reject Sort Bins.
2D Matrix Strip Barcode Marking Laser System
Utilizes new generation solid-state Fiber Laser systems with a unique combination of high peak power, ideal beam quality, fiber delivery and efficiency. The system is safe, compact, and service-free, designed to meet individual marking needs with the ability to mark a wide variety of materials including Direct Part Marking (DPM).
Product: Strip width: 15 ~ 120 mm
Handling System: Pre-loading protection feature, Auto-Pick and Place.
Function: Laser Marking. Vision Inspection
Marking Applications: Alphanumeric, Logos, Serial Numbers, Part Numbers, Lot and Date Codes, 2D Barcode, Schematics, Graphics, and more.
Magazine to Magazine AOI Laser System
Uses a high powered and intelligent laser system and advanced linear motion indexing technology to perform laser marking and trimming process on lead frames.
Product: Wide Variety Leadframes
Handling: Magazine Loader/Unloader, linear motion indexer,
Function: Trimming(Laser Cutting), Laser Marking including Direct Part Marking (DPM) of Alphanumeric, Logos, Serial Numbers, Part Numbers, Lot and Date Codes, 2D Barcode, Schematics, Graphics, and more.
ATMOSPHERIC PLASMA PROCESS SYSTEM
Uses a direct plasma technology designed to perform surface treatment to various components prior to Bonding, Molding, Laminating, Coating, Pattern Inspection and more.
Product: Customizable to different lead frame sizes
Handling: Carrier, 180 ° Flipper
Function: Plasma Surface Treatment to Improve Adhesion, Laminating and Bonding Strength
Application for lead frame: Molding, Component Attach, Bonding
