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Brand New Diamond Wire Wafering Saw
   FASA DWS-1336

FA Systems has been constantly seeking new technological breakthroughs and innovations over the years to provide better systems and solutions to customers while cutting down costs.

FA Systems has conceived, developed, designed, and successfully realized the next-generation Silicon Ingot Wire-Saw Equipment, which is used in the Solar Industry for slicing of ingots into wafers. The result is a brand new system that can slice silicon ingots into ultra-thin wafers so as to significantly reduce the total cost of solar photovoltaic (PV) panel manufacturing


Highlights

Makes use of Diamond Wire!
Technology Leap: Overcomes key limitations of existing Slurry-based Slicing Systems!
Green Technology: Cleaner & Faster Process; Complex Slurry Management Equipment not required!
Fastest to ROI

Proven System

FASA Diamond Wire-Saw is already a proven system.
Excellent Surface finish that is comparable to Slurry, no surface damage  (Ra<1.5um or Rz<7um).
Proven cutting Accuracy & Repeatability (TTV<25um), (CpK>1.55).
Small Kerf loss.
Successful cutting of thinner wafers (0.15mm).
High Yield (>98%).
Many new break-through Innovations built into the System to achieve high quality, high throughput and high yield while minimizing downtime.


Lowest Total Cost of Ownership (TCOO)



Recycling Technology – FASA offers solvent recycling technology to achieve significant cost reductions in Wafering plant.
Efficient and easier Si recovery; efficient recycling of Coolant


VIEW MACHINE BROCHURE
VIEW MACHINE VIDEO


EXISTING WIRE-SLICING TECHNOLOGY


The Wire-Saw cutting of silicon ingots is a key step in the production of Photovoltaic (PV) cells.
In the conventional process, a stainless steel wire and an abrasive "slurry" are used to accomplish the slicing operation for production of wafers.


MAIN DISADVANTAGES OF EXISTING SLURRY-BASED SYSTEMS

Major Expense and Environmental Issue
Abrasive slurry consists of abrasive silicon carbide particles (SiC) and polyethylene glycol (PEG).
Becomes polluted during the wafer cutting process by silicon dust, metal particles from the saw wire and water.
Therefore slurry needs to be replaced with fresh slurry to ensure efficient cutting process.
Large volume of slurry is generated - Disposal is both prohibitively expensive and an environmental issue!
Spent slurry contains a large fraction of usable precious silicon, recovery difficult & cost prohibitive!