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LM-902CD - Strip-to-strip Laser Marking System
DS501 - Die Sorter Machine
GT-201 - Tube-to-Tube Gravity Feed Test Handler
GT-401 - Tube-to-Tube Gravity Feed 4 in 1 Test Handler
Multi Site Pick & Place Test Handler
Lead Frame Processing Equipment
Third Optical Inspection Machine
Silicone Dispensing Machine
Saw Singulation System
Auto Substrate Sorting Machine
 
LM-902CD STRIP-TO-STRIP LASER MARKING SYSTEM

The LM-902CD Strip-to-Strip Laser Marking System incorporates many new Innovative designs and Hi-speed features. It can cater for different product packages and is capable of handling all standard semiconductor packages such as PLCC, PDIP, SOIC, SOJ, SSOP, QFN, QFP, BGA, and others.

This system is capable of handling Strips in SLOTTED or STACKED magazine as well as in-line, and can handle Strips with a wide range of sizes. Rapid product conversion between different packages is achieved by Programmable Product Conversion through software setting.

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DS501 DIE SORTER MACHINE

The Die Sorter Machine is designed for the automatic sorting and packaging of Die on Wafers after top and bottom inspection.

The wafers are first loaded to Wafer Holder for top inspection by Top Vision 1.  All Die without the reject ink mark are transferred to Bottom Vision station for bottom inspection for defects such as crack, etc. The reject Die are unloaded to reject bin and other Die are transferred to Top Vision 2 for further inspection for defects, such as detection of chipping, contamination, etc. After Top Vision 2 inspection, the reject Die are unloaded to reject bin, and the good Die are unloaded onto tray module, or packaged on Tape and Reel station based on User’s selection.

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GT-201 TUBE-TO-TUBE GRAVITY-FEED TEST HANDLER

The Tube-to-Tube Gravity-Feed Test Handler is designed for the automatic transfer of IC Packages or Devices contained in plastic tubes to more than one test stations for the testing and sorting of devices into defective and non-defective categories.

The devices are transferred from plastic tubes; singulated, and are conveyed to the Test Stations, where Customer-defined tests, such as High Voltage Test or Functional Tests are performed on each package. A single stack tube input magazine allows multiple tubes loading capacity, and the packages are transferred through the gravity track system. The “Passed” and “Failed” packages are then unloaded into separate designated plastic tubes.

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GT-401 TUBE-TO-TUBE GRAVITY-FEED 4 IN 1 TEST HANDLER

The Tube-to-Tube Gravity-Feed 4 in 1 Test Handler is designed for the automatic transfer of IC Packages or Devices contained in plastic tubes to Function Test, Laser Marking, and Vision Check stations for testing and for sorting of the devices into different categories according to the test results, such as Grade A, Grade B, Grade C, and so on. The packages, after testing, can then be unloaded to different tubes, or packaged on Tape and Reel station based on User’s selection.

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MULTI SITE PICK & PLACE TEST HANDLER

The Multi Site Pick&Place Test Handler is a fully automation system that is designed to test multiple semiconductor packages at one time.

The Packages will be automatically transferred to Orientator. During the transfer process, Vision checks the packages’ orientation. If the orientation is wrong, it will be changed to the correct position. After which the packages will be indexed to Multi Site Test station. Good packages will be packaged on Tape and Reel station, while NG packages will be automatically unloaded into Sort Bins.

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LEAD FRAME PROCESSING EQUIPMENT

Used for lead frame packages. These machines include slotted magazines for loading and unloading. The standard platform can be customized and is expandable for various applications - can be integrated with bowl feeders, JEDEC tray carrier, tape punching, lid-cover attachment, vision camera for inspection, epoxy and silicone dispensing units, flip and combine rows of die on lead frame, laser unit for welding and marking.


THIRD OPTICAL INSPECTION MACHINE

The Third Optical Inspection Machine has been designed to eliminate the handling process problem when inspecting the wire bond. It will reduce the risk of damaging the wire bond on the lead frame. It allows the operator to inspect the die and the wire bond without having to touch the unit.

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SILICONE DISPENSING MACHINE

The Silicone Dispensing Machine is designed to dispense silicone onto each die on the product package.

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SAW SINGULATION SYSTEM

Saw Singulation System to perform accurate dicing of advanced array packages. Patented design incorporating Twin Spindles Actuator Mechanism. Cutting is achieved in both forward and reverse motions of the substrate on two separate precision guides, with concurrent loading/ unloading and vision inspection and alignment, resulting in more than 40% to 50% improvement in throughput.

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AUTO SUBSTRATE SORTING MACHINE

The Auto Substrate Sorting Machine is a fully automated system, which is designed for the automatic transfer of Substrates contained in the Input drawer to Top Vision and Bottom Vision stations for sorting of the substrates into different categories.

The Auto Substrate Sorting Machine adopts 32 (4x8) reject bins for 32 categories and can separate 32 categories at one time setting. The machine will unload the substrates to different Bins according to the Vision Check Results, and inserted a white paper spacer between each two substrates.

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