2010 to 2012
Continuously achieve new technological breakthroughs and innovations to provide better systems and solutions to customers while cutting down costs.
Created new High-speed/ High Precision fully automatic equipments and solutions for various applications including Test handlers, Testing and Packaging, Assembly, Inspection, Laser Marking including Vision Inspection, Laser Welding, Labeling, Chiller Systems, Curing Systems, Die Inspection and Sorting Systems and many others systems for Semiconductor, Electronics, Automotive, Hard Disk / Media, G6/ G7/ G8 LCD Glass Inspection and others.
Conceived, developed, designed, and successfully realized the next-generation Wire-Saw Equipment, which is used in the Solar Industry for slicing of ingots into wafers. The result is a brand new system that can slice silicon ingots into ultra-thin wafers so as to significantly reduce the total cost of solar photovoltaic (PV) panel manufacturing.